Customer-oriented solutions via packaging and interconnection technology
Packaging and interconnection technology as a component of microelectronics and microsystems technology completes and functionalizes an electronic circuit by adding further components up to the complex microelectronic system.
For high-precision packaging we offer customer-oriented solutions, for example the assembly and contacting of semiconductor chips by means of wire bonding (ball-wedge, wedge-wedge and ribbon bonding) as well as the processing of flip chips of different dimensions, also taking into account thermal aspects.
The surface mounting of SMD components using various soldering and adhesive technologies and the protection of mounted components using automated encapsulation technologies completes your electronic system.
