Microscopy, X-rays and profilometry

The following non-destructive methods are available for the investigation of structures and topographies in the submicrometer to centimeter range:

  • Optical microscopy
  • Scanning electron microscopy
  • Laser scanning microscopy
  • X-rays
  • Sonography
  • optical and mechanical profilometry

Electrical, RF- and thermal characterization

For qualification (e.g. reliability) of packaging processes we offer pull and shear tests but also sonography and climatic change tests

The following methods are offered for the evaluation of the function of complete circuit carriers:

  • Electrical characterization
  • RF characterization up to 20 GHz
  • Thermal characterization

High performance electronic solutions.